（７−２−２） ＮＥ・ＳＡＣ＋Ｘ（Ｎｉ、Ｃｏ、Ｆｅ・・・）
SAC+Co Ｆａｎｇｊｅ 引っ張り強度 バルク
SAC305
Ｈａｒｔｆｏｒｄ
Ｈｕｎｇ 台湾成功大
Ｓｎ−３．５−０．５Ｃｕ−ｘＮｉ
Ａ：（Ｃｕ，Ｎｉ）６Ｓｎ５ Ｂ：（Ｃｕ，Ｎｉ）３Ｓｎ４
Huang
初晶AlAg、AlCu
針状：（Ni,Cu)3Sn4、白い析出物：Ag3Sn
CuAl、AgAl
Ｓｎ３．９２Ａｇ０．６２Ｃｕ０．１５Ａｌ０．０５Ｎｉ、Ｓｎ４．０Ａｇ０．５８Ｃｕ０．６Ａｌ０．０４Ｎｉ
（７−２−３） ＮＥＳＡＣ＋Ｚｎ
Kang SAC
Kotadia
ＳＡＣ３８７ ０．５−１．５Ｚｎ、Ｎｉ−Ｐ
SEM images showing the grain sizes in fabricated ingots of different solder alloys: (a) SAC, (b) SAC-0.5Zn, (c) SAC-1Zn, and (d) SAC-1.5Zn
２
SEM images showing the interfacial microstructures for different systems after reflow on Cu substrate: (a) SAC, (b) SAC-0.5Zn, (c) SAC-1Zn, and (d) SAC-1.5Zn. The inserts show low magnification optical images where θ represents the solder ball contact angle.
３
Representative SEM images of Cu6Sn5 and/or (Cu,Zn)6Sn5 from top view for different systems: (a) SAC, (b) SAC?0.5Zn, (c) SAC-1Zn, and (d) SAC-1.5Zn, after reflow on Cu
４
Representative SEM images of Cu6Sn5 and/or (Cu,Zn)6Sn5 from top view for different systems: (a) SAC, (b) SAC-0.5Zn, (c) SAC-1Zn, and (d) SAC-1.5Zn, after 100 h of storage at 150 °C
５
SEM images showing IMC growth after 1000 h of storage at 150 °C on Cu substrate for different systems: (a) SAC, (b) SAC-0.5Zn, (c) SAC-1Zn, and (d) SAC-1.5Zn
６
Plots of mean IMC thickness versus storage time (a) thickness of Cu3Sn IMC layer, (b) thickness of Cu6Sn5 and (Cu,Zn)6Sn5 IMCs layer, (c) total IMC thickness, and (d) thickness of Cu5Zn8 IMC for the SAC-1.5Zn/Cu system, where the value corresponding to 0 h stands for the as-reflowed samples and the dotted line in figure (c) indicates the starting point of spalling of Cu6Sn5 IMC particles. All samples stored at 150 °C
７
Plots of mean IMC thickness versus storage time at 185 °C.
８
Cumulative probability curves of the thickness of (a) Cu3Sn and (b) Cu6Sn5 or (Cu,Zn)6Sn5 formed on Cu substrate, stored at 150 °C for 1000 h on the normal coordinates
９
SEM images showing the interfacial microstructures for different systems on Ni?P substrate: (a) SAC, (b) SAC-0.5Zn, (c) SAC-1Zn, and (d) SAC-1.5Zn. The inserts show low magnification SEM images where θ represents the solder ball contact angle.
１０
Representative SEM images of (Cu,Ni)6Sn5 and/or (Cu,Ni,Zn)6Sn5 from top view for different systems: (a) SAC, (b) SAC-0.5Zn, (c)SAC-1Zn, and (d) SAC-1.5Zn (insert shows images of Ni?Cu?Sn?Zn?Au particles), after reflow
１１
Representative SEM images of (Cu,Ni)6Sn5 and/or (Cu,Ni,Zn)6Sn5 from top view for different systems: (a) SAC, (b) SAC-0.5Zn, (c) SAC-1Zn, and (d) SAC-1.5Zn, after 100 h of storage at 150 °C on Ni?P substrate.
１２
SEM images showing IMC growth after 1000 h of storage at 150 °C on Ni?P substrate for different systems: (a) SAC, (b) SAC-0.5Zn, (c) SAC-1Zn, and (d) SAC-1.5Zn.
Plots of mean IMC thickness versus storage time for different systems: (a) stored at 150 °C and (b) stored at 185 °C
Cumulative probability curves of the thickness of (Cu,Ni)6Sn5 and/or (Cu,Ni,Zn)6Sn5 formed on Ni-P substrate, stored at 150 °C for 1000 h on the normal coordinates.
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