（１１－４－８）　Ｃｕ基体とＮｉ基体の比較

①　ＣｕとＮｉ－Ｐ／Ａｕ

塚本　主なはんだとＣｕの界面の典型的状態
　Sn-0.7Cu、Sn-0.7Cu+Ni、SAC307、Sn-37Pb、ＢＧＡ

　２回リフロー
SEM cross-sectional micrographs of IMC layers formed at the solder/Cu substrate interface
in 2-reflowed samples of (a) SC, (b) SCN, (c) SAC and (d) SP

SEM cross-sectional micrographs of IMC layers formed at the solder/Cu substrate interface in the samples aged at 125 °C
for 1000 h. (a) SC, (b) SCN, (c) SAC and (d) SP

Average thickness of the IMC layers formed between the SC, SCN, SAC and SP solders, and Cu substrates
in the samples subjected to 1, 2 and 4 reflows and after aging at 125 °C for 500 and 1000 h.

Morphology parameter, M, for SC, SCN, SAC and SP samples subjected to 1, 2 and 4 reflows and
aged at 125 °C for 500 and 1000 h.

Failure model of BGA joints subjected to shear loadings. (a) Impact force-displacement curves (SCN aged at 125 °C for 1000 h,
Displacement rates: 10, 100 and 4000 m/s). (b) SEM micrographs of the same samples after shear impact tests. (c) Failure model.

Failure model of BGA joints subjected to tensile loadings. (a) Impact force-displacement curves (SCN BGAs aged at 125 °C for 1000 h,
Displacement rates: 1 and 400 mm/s). (b) SEM micrographs of the same samples after tensile impact tests. (c) Failure model.

The deformation energy and maximum force during the shear impact tests for 2-reflowed and
aged SC ((a) and (b)), SCN ((c) and (d)), SAC ((e) and (f)) and SP ((g) and (h)).
The deformation energy is divided into two parts such for before- and after- maximum forces

The deformation energy and maximum load during the high speed shear impact tests (4000 mm/s) for various reflow times (1, 2, and 4)
and aging time (at 125 °C for 500 and 1000 h). The deformation energy is divided into two parts for the before- and after-maximum forces.
The failure types are also shown in the figures. (a) SC, (b) SCN, (c) SAC and (d) SP

The deformation energy and maximum force during the tensile impact tests for 2-reflowed and
aged SC ((a) and (b)), SCN ((c) and (d)), SAC ((e) and (f)) and SP ((g) and (h)).
The deformation energy is divided into two parts such for before- and after- maximum forces.

The deformation energy and maximum load during the high speed tensile impact tests (400 mm/s) for various reflow times (1, 2, and 4)
and aging time (at 125 °C for 500 and 1000 h). The deformation energy is divided into two parts such as the before-
and after-maximum force ones. The failure types are also shown in the figures. (a) SC, (b) SCN, (c) SAC and (d) SP

同様にＮｉ－Ｐ／Ａｕの場合

SEM cross-sectional micrographs of IMC layers formed at the four types of compositions of BGAs/NiAu substrate interface
in 2-reflowed samples of (a) SC, (b) SCN, (c) SAC and (d) SP
　

SEM cross-sectional micrographs of IMC layers formed at the four types of compositions of BGAs/NiAu substrate interface
in deep aged (125 °C, 1000 h) samples of (a) SC, (b) SCN, (c) SAC and (d) SP.

Average thickness of the IMC layers formed between the SC, SCN, SAC and SP solders, and Ni (P)/Au surface-finished substrates
as a function of the number of reflows and aging time.

Ratio of height to bottom of a periodically arranged isosceles triangle in the IMC layers plotted against the reflow times and aging time.

The deformation energy and maximum force during the shear impact tests for 2-reflowed and aged SC ((a) and (b)), SCN ((c) and (d)), SAC ((e)
and (f)) and SP ((g) and (h)). The deformation energy is divided into two parts such for before- and after-maximum forces.

The deformation energy and maximum force during the high speed shear impact tests (4000 mm/s) for various reflow times (1, 2, and 4)
and aging time (at 125 °C for 500 and 1000 h). The deformation energy is divided into two parts for the before- and after-maximum forces.
The failure types are also shown in the figures. (a) SC, (b) SCN, (c) SAC and (d) SP

The deformation energy and maximum force during the tensile impact tests for 2-reflowed and aged SC ((a) and (b)), SCN ((c) and (d)), SAC ((e) and (f)) and SP ((g) and (h)). The deformation energy is divided into two parts such for before- and after-maximum forces

The deformation energy and maximum force during the high speed tensile impact tests (400 mm/s) for various reflow times (1, 2, and 4) and
aging time (at 125 °C for 500 and 1000 h). The deformation energy is divided into two parts such as the before- and after-maximum force ones.
The failure types are also shown in the figures. (a) SC, (b) SCN, (c) SAC and (d) SP

Ｙｏｏｎ　
　Ｓｎ－０．７ＣｕとＣｕ、Ｎｉ－Ｐ／Ａｕ

The SEM micrographs of the Sn-0.7Cu/Cu interface reflowed at 255 °C for various times; (a) 1 s, (b) 1 min, (c) 10 min and (d) 30 min.

The SEM micrographs of the Sn-0.7Cu/electroless Ni-P interface reflowed at 255 °C for various times; (a) 1 s, (b) 1 min, (c) 10 min and (d) 30 min.

The thickness of the Cu₆Sn₅, (Cu, Ni)₆Sn₅ and Ni₃P layers formed at the interface between Sn?0.7Cu solder
and two different (Cu and electroless Ni?P) substrates with reflow time.

Ｌｅｅ
　ＳＡＣ３５７５ＢＧＡ
　Ｎｉ－１５at％Ｐ／０．１５μｍＡｕ