（１１−７−５）　Ｓｎ−３．５Ａｇ−ｘＺｎ

�@　Ｃｕ基体

Ｊｅｅ　韓国のＫＡＩＳＴ　
Ｓｎ−３．５Ａｇ−ｘＺｎとＣｕ
　Ｚｎ量増加でＣ６Ｓｎ５がＣｕ５Ｚｎ８とＡｇ５Ｚｎ８に交替。
　Ｃｕ５Ｚｎ８は最初はんだ中に出現し、エージングで連続層化。
　ＺｎはＣｕ３ＳｎとKirkendallボイドを抑制する。







Ｊｅｅ　Sn-3Ag-xZn　　１、３、７




�A　Ｎｉ基体

Sn-Ag-Zn Jee　Ｓｎ−３．５Ａｇ−ｘＺｎとＮｉ−Ｐ












（１１−７−６）　Ｓｎ−０．７Ｃｕ−ｘＺｎ

�@　Ｃｕ基体

　ＫＡＩＳＴのグループ　ＳｎＣｕ−Ｚｎ
　Ｓｎ−０．７Ｃｕ−ｘＺｎ　０．２、０．４、０．８　Ｎｉ−Ｐ（５）／Ａｕ（０．０５）








Ｓｎ−Ｃｕ−Ｚｎ　Ｗａｎｇ　ハルビン工科大　Ｓｎ−０．７Ｃｕ−ｘＺｎとＣｕ


Microstructures of the tested bulk alloys (a) Sn-0.7Cu, (b) Sn-0.7Cu-0.2Zn, (c) Sn-0.7Cu-1.0Zn.

Development of interfacial IMC layer of Sn-0.7Cu solder/Cu joint thermally aged at 150 °C (a) as-soldered, (b) aged for 10 days, (c) aged for 20 days.


Development of interfacial IMC layer of Sn-0.7Cu-0.2Zn solder/Cu joint thermally aged at 150 °C (a) as-soldered, (b) aged for 10 days, (c) aged for 20 days


Development of interfacial IMC layer of Sn-0.7Cu-1.0Zn solder/Cu joint thermally aged at 150 °C (a) as-soldered, (b) aged for 10 days, (c) aged for 20 days




�A　Ｎｉ基体

ＩＢＭ　Ｓｎ−Ｃｕ−Ｚｎ　Ｎｉ
　Ｓｎ−０．７Ｃｕ−ｘＺｎ　


　（Ｃｕ，Ｎｉ）６Ｓｎ５と（Ｃｕ，Ｎｉ，Ｚｎ）６Ｓｎ５





Sn-０．７ＣｕにはＳｎ−Ｃｕ−Ｎｉ、Ｓｎ−０．７Ｃｕ−０．４ＺｎにはＳｎ−Ｃｕ−Ｎｉ−Ｚｎ




（１１−７−７）　Ｓｎ−９Ｚｎ−Ｃｕ

Ｓｎ−Ｚｎ−Ｃｕ
　Ｓｎ−９Ｚｎ−ｘＣｕ　Ｃｕ
　　Ｃｕ５Ｚｎ８
　　２−６％ＣｕではＣｕ６Ｓｎ５とＣｕ５Ｚｎ８
　　８％以上ではほとんどＣｕ６Ｓｎ５だけ

　



Ｙｕ
　Ｓｎ−９Ｚｎ−ＣｕとＣｕ基体
　　２＜Ｃｕ＜６　Ｃｕ６Ｓｎ５とＣｕ５Ｚｎ８
　　８、１０ではＣｕ６Ｓｎ５

（１１−７−８）　Ｓｎ−Ｚｎ−Ｉｎ


Sn-Zn-In　ポーランドのＦｉｍａ
　Ｓｎ−８．８Ｚｎ−ｘＩｎ　ｘ＝０．５、１．０、１．５
Ｃｕ５Ｚｎ８、Ｎｉ５Ｚｎ２１
　Ｎｉの場合Ｓｎ−８．８Ｚｎ−１．５ＩｎではＳｎ−８．８Ｚｎと比べ薄く不連続。



　Cu:：Cu5Zn8
　Ni:：Ni5Zn21




（１１−７−９）　Ｓｎ−Ｚｎ−Ｘ


Sn-Zn＋Cr

IMC of Sn-9Zn/Cu and Sn-9Zn-Cr/Cu interface as-soldered, (a) Sn-9Zn, (b) Sn-9Zn-Cr (5000×, bar = 10 μm).



Top view of the IMC after soldering at 230 °C for (a) Sn-9Zn/Cu and (b) Sn-9Zn-Cr/Cu (20,000×, bar = 2 μm).


The relationship curves between IMC thickness, aging temperature, and aging time (h^1/2).

Arrhenius plot of Cu₅Zn₈ formed by Sn?9Zn/Cu and Sn-9Zn-Cr/Cu.


EDX mappings of ZnCr phase in bulk Sn-9Zn-Cr.

（１１−７−１０）　Ｓｎ−Ｚｎ−Ｘ−Ｙ

　Ｓｎ−Ａｇ−Ｂｉ−Ｚｎ
　ＳＡＣ＋Ｚｎ

Ｎａｋａｈａｒａ
　Ｓｎ−３．５Ａｇ−５Ｂｉ−ｘＺｎ
　Ｚｎ添加ではんだ／Ｃｕ６Ｓｎ５／Ｃｕ３Ｓｎ／Ｃｕからはんだ／Ｃｕ５Ｚｎ８／Ｃｕ６Ｓｎ５／Ｃｕ
　接合強度低下と反応層成長が抑制
　Ｃｕ５Ｚｎ８がＣｕ６ｓｎ５成長のバリア層
　Ｚｎ１％が適正。





秋田大　ＳｎＡｇＢｉ＋Ｚｎ







　大阪大柳川らにはＳｎ−８Ｚｎ−３ＢｉにＡｇ、Ｃｕ、Ｐｂを添加している。
　基本的組織はＳｎマトリクスにＢｉと針状Ｚｎが析出した構造となっている。
　Ｃｕとの界面はＣｕ側からＣｕ５Ｚｎ８、ＣｕＺｎ６のＺｎ金属間化合物の２層構造である。
　Ａｇ添加の場合、Ｃｕ５Ｚｎ８、（Ａｇ，Ｃｕ）Ｚｎ３となる。
　高温保持ではいずれもＣｕ５Ｚｎ８の１層となる。
　Ａｇ添加の場合、はんだ中にＡｇＺｎ３形成。
　Ａｇ添加で界面のＩＭＣ成長抑制。
　
　

　
　




Sn-Zn-Cu+Bi+Ni,
　Sn-9Zn-2Cu(SZC)＋Ni
　SZCはZnをCu-Zn　IMCとしZnの酸化抑制。SZCは２１５℃で共晶に近い反応。


　Cuとの反応


Ｋａｎｇ　マイナー添加　ＩＢＭ　Ｒｅｓｅａｒｃｈ　Ｒｅｐｏｒｔ





Kotadia
　　SAC　Zn　Ni-P

SEM images showing the grain sizes in fabricated ingots of different solder alloys: (a) SAC, (b) SAC-0.5Zn, (c) SAC-1Zn, and (d) SAC-1.5Zn


SEM images showing the interfacial microstructures for different systems after reflow on Cu substrate: (a) SAC, (b) SAC-0.5Zn,
(c) SAC-1Zn, and (d) SAC-1.5Zn. The inserts show low magnification optical images where θ represents the solder ball contact angle.


Representative SEM images of Cu₆Sn₅ and/or (Cu,Zn)₆Sn₅ from top view for different systems:
(a) SAC, (b) SAC-0.5Zn, (c) SAC-1Zn, and (d) SAC-1.5Zn, after reflow on Cu


Representative SEM images of Cu₆Sn₅ and/or (Cu,Zn)₆Sn₅ from top view for different systems:
(a) SAC, (b) SAC-0.5Zn, (c) SAC-1Zn, and (d) SAC-1.5Zn, after 100 h of storage at 150 °C


SEM images showing IMC growth after 1000 h of storage at 150 °C on Cu substrate for different systems:
(a) SAC, (b) SAC-0.5Zn, (c) SAC-1Zn, and (d) SAC-1.5Zn


Plots of mean IMC thickness versus storage time (a) thickness of Cu₃Sn IMC layer, (b) thickness of Cu₆Sn₅
and (Cu,Zn)₆Sn₅ IMCs layer, (c) total IMC thickness, and (d) thickness of Cu₅Zn₈ IMC for the SAC-1.5Zn/Cu system,
where the value corresponding to 0 h stands for the as-reflowed samples and the dotted line in figure (c)
indicates the starting point of spalling of Cu₆Sn₅ IMC particles. All samples stored at 150 °C


Plots of mean IMC thickness versus storage time at 185 °C.


Cumulative probability curves of the thickness of (a) Cu₃Sn and (b) Cu₆Sn₅ or (Cu,Zn)₆Sn₅ formed on Cu substrate,
stored at 150 °C for 1000 h on the normal coordinates


SEM images showing the interfacial microstructures for different systems on Ni?P substrate: (a) SAC, (b) SAC-0.5Zn,
(c) SAC-1Zn, and (d) SAC-1.5Zn. The inserts show low magnification SEM images where θ represents the solder ball contact angle.


Representative SEM images of (Cu,Ni)₆Sn₅ and/or (Cu,Ni,Zn)₆Sn₅ from top view for different systems: (a) SAC,
(b) SAC-0.5Zn, (c)SAC-1Zn, and (d) SAC-1.5Zn (insert shows images of Ni-Cu-Sn-Zn-Au particles), after reflow


Representative SEM images of (Cu,Ni)₆Sn5 and/or (Cu,Ni,Zn)₆Sn₅ from top view for different systems:
(a) SAC, (b) SAC-0.5Zn, (c) SAC-1Zn, and (d) SAC-1.5Zn, after 100 h of storage at 150 °C on Ni?P substrate.
１２

SEM images showing IMC growth after 1000 h of storage at 150 °C on Ni-P substrate for different systems:
(a) SAC, (b) SAC-0.5Zn, (c) SAC-1Zn, and (d) SAC-1.5Zn.


Plots of mean IMC thickness versus storage time for different systems: (a) stored at 150 °C and (b) stored at 185 °C


Cumulative probability curves of the thickness of (Cu,Ni)₆Sn₅ and/or (Cu,Ni,Zn)₆Sn₅ formed on Ni-P substrate,
stored at 150 °C for 1000 h on the normal coordinates.

Kotadia　英国王立カレッジ　Ｃｕ−Ｚｎ、Ｃｕ−Ａｌ　のマッシブ剥離　はんだとＣｕ
SAC-Zn　SAC-2.0Al
ＳＡＣ３８７＋Ｘ　Ｘ＝Ｚｎ、Ａｌ









ＢｉらＣｒ添加
　Sn-８Zn-３Bi-Cr

Microstructure evolution in Sn-8Zn-3Bi solder joints with Cu substrates during aging at 150 °C for (a) 4, (c) 9,
(e) 25 days and in Sn-8Zn-3Bi-0.3Cr solder joints during aging at 150 °C for (b) 4, (d) 9, (f) 25 days.


Microstructure evolution in Sn-8Zn-3Bi solder joints with Ni substrates during aging at 150 °C for (a) 16, (c) 25 days and
in Sn-8Zn-3Bi-0.3Cr solder joints during aging at 150 °C for (b) 16, (d) 25 days.

 γ-Cu5Zn8 IMCs growth with increased aging time (day^1/2):(a) Sn-8Zn-3Bi/Cu interface; (b) Sn-8Zn-3Bi-03Cr/Cu interface.

γ-Ni₅Zn₂₁ IMCs growth with increased aging time (day^1/2):(a) Sn-8Zn-3Bi/electroplated Ni interface; (b) Sn-8Zn-3Bi-03Cr/electroplated Ni interface.

EDS analysis of Cr contained phase: (a) as-reflowed, (b) after aging for 25 days.


　Ｓｎ−Ｂｉ−Ｚｎ−Ｓｂ




Sogo
　０．３ｍｍのＳＡＣ３０５はんだボールをＳｎ−８Ｚｎ−３Ｂｉで接合。ＰＣＢ：無電解Ｎｉ−Ｐ／Ａｕ
　



　　　Ｎｉ−Ｓｎ−Ｃｕ−ＺｎはＮｉ３Ｓｎ４タイプ　（Ｎｉ，Ｃｕ）３（Ｓｎ，Ｚｎ）４

　Ｅでは界面から離れてＡｕ−Ｚｎ層（ＡｕＺｎ３）形成。温度が高いとＡｕ−Ｚｎは
　０．０５μｍＡｕでも２１０℃ではＡｕ−Ｚｎ層形成、ただし温度が高いとＡｕ−Ｚｎははんだに溶解し（Ｎｉ，Ｃｕ）３（Ｓｎ，Ｚｎ）４形成。





　Ａｕが薄いほうが、リフロー温度はやや高めが良い。
　Ａｕ−Ｚｎがはんだへ溶け込んでＮｉ３Ｓｎ４が形成されるようにする。



Ｉｓｌａｍ
各種はんだとＣｕ基体
Ｃｕ消費は
　　Ｓｎ−Ｚｎ−Ｂｉ＞ＳｎＡｇ−Ｃｕ＞Ｓｎ−Ｚｎ＞Ｓｎ−Ｐｂ
　　γＣｕ５Ｚｎ８、βＣｕＺｎ、薄い不明Ｃｕ−Ｚｎ


Ｃｈｅｎｇ　清華大



Chou

　２５０℃等温面



　２１０℃


　１８０℃

Ｐｅｒｏｖｉｃら



Ｈｕａｎｇ

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